LAMIXATKD TRANSMISSION LINES. I 947 



C: A parameter related to the degree of iioimiiiforniity in a 



laminated medium (Section XII). 

 E: Electric field intensity; coordinate subscripts indicate 



components. 

 /: Frequency. 



g: Electrical conductivity. 



g: 6gi ; average conductivity parallel to laminated stack. 



//: Magnetic field intensity; coordinate sul)scripts indicate 



components. 

 /;: —iKo', a transverse separation constant (Section X). 



/ : Electric current. 



J: Electric current density; coordinate subscripts indicate 



components. 



K: Characteristic impedance of stack of infinitesimally thin 



laminae. 



A'l , K> : Characteristic or iterati\'e impedances of laminated stack 

 (introduced in Section III). 



/,•: A parameter related to dielectric mismatch in a Clogston 



1 line (Section VI). 



M: The general circuit parameter matrix (aCBCSD-matrix). 



m: A mode numbei'. 



n: Number of double layers in a laminated stack. 



p: A mode number. 



q: A parameter related to the propagation constant in a 



Clogston 2 line (Section XI). 



R: A-c resistance of a laminated stack. 



r: Ratio of attenuation constants of Clogston and conven- 



tional lines (Section XII). 



s: Thickness of a laminated stack. 



Si , So : Thicknesses of inner and outer stacks in a coaxial Clog- 



ston 1. 



T: Total thickness of conducting material in a laminated 



stack (subscripts explained in context). 



Ta : Total thickness of conducting material in one effective 



skin depth. 



t: Thickness of an electrically homogeneous layer. Time. 



^1 : Thickness of a single conducting layer. 



^2 : Thickness of a single insulating layer. 



V: Electric potential. 



w: An abbreviation for II y in Section XII. 



