ItM 



INDEX TO VOL. I. 



Deposition by two metal* nd two liquids, 



iVpoition, to prevent, 229. 

 Dipping liquid., 216. 



: .n of electric currents, 209. 

 DiMolving pl*tc, petition of. 232. 

 Dynamic conditions, 21U. 



ELAITIC moulding, 216, 229, 230. 



Elastic moulding composition, 216, 230. 



EUetrio current*, direction of, 209. 



Flectric decomposition of liquids, 209. 



Electrical condition* required for deposi- 

 tion. 203, 207. 



Electrical conducting circuit. 208. 



Electrical polarity of dissolving metals, 

 207. 



Electrical relations between tin and iron, 

 221. 



Electrical terms of decomposition, 207, 

 209. 



Electricity, sources of, 213. 



Electro-chemical scale of elements, 209. 



Electro-deposition, practice of, 213. 



Electro-deposition substituted for stereo- 

 typing, 234. 



Klet-tro-depofition, theory of, 197. 



Klri-tro-gilding liquid, 227. 



Electro-plating liquids, 224. 



Electrodes defined, 211, 239 



Electrodes, position and form of, 210. 



Electrodes, size, &c., of, 21 2. 



Electrolysis, binary theory of, 212. 



Elements, atomic weight of, 211. 



Elements, electro-chemical scale of, 209. 



Engraved plates, Joubcrt's process of 

 acieraging, 239. 



Etching copper, 235. 



Explosive power of antimony freshly de- 

 posited, 219. 



FACTS of electro-deposition, 198. 



Finishing plated articles, 236. 



Fizeau's gilding liquid, 228. 



Flowers, to copy in copper, 234. 



Fluidity essential to deposition, 205. 



Form of electrodes, 211. 



Formula for gilding copper, 228. 



Free acids required in metallic solutions 



for deposition, 207, 217. 

 Furnaces, boilers, &c., 213. 



GENERAL rales, 232. 



German silver, deposition of, 223. 



Gilding by immersion and solutions, 227, 



228. 



Gilding liquids, various, 228. 

 Gilding folutions, management of, 236. 

 Glass surfaces for deposition, preparing, 



230. 



Glypbography, 235. 

 Gold, chloride of, 226. 

 Gold, cyanide of, 227. 

 Gold deposition by battery process, 227. 

 Gold immersed in acids is not affected, 



204. 

 Gold, recovery of from solutions, 236, 



238. 

 Gold solution for battery process, 226, 



227. 



' 



HFAT and deposition, 209. 

 Uydrochlorate of terchloride of antimony 



coats many metals with antimony, 



Hypo. nitrite of lead coat* copper, tin, and 

 brass with lead, if in contact with zinc, 

 200. 



Ixumsiox of irtirles in the vat, 230. 

 Influence of light on deposition, 210. 

 Influence of temperature, 210. 



ty of rlrrtriral current, 231. 

 Iron immersed in solution of sulphate of 

 copper, effect! on, 1'j'j. 



1 Iron, Joubert's process of depositing, 239. 

 Iron solutions and salts, 221. 



JOI-BEBT'I acierage process, 239. 



LKAO salts and solutions, 221. 



Length of connecting wires. 212. 



' solution for gilding silver, 228. 



Light, effect of, on depositing liquids, 233. 



Liquids prevented from mixing by a porous 

 partition, 199. 



List of patents connected with electro- 

 deposition, 239. 



Logical conditions of deposition, 212. 



Lyons and Milliard's patent silvering 

 process, 225. 



M \RNET and coil depositions, 202. 

 Magneto-electric machine, 213. 

 Making depositing solutions, 217. 

 Management of batteries, 232. 

 Management of copper solutions, 233. 

 Management of silver solutions, 235. 

 Managing gilding solutions, 236. 

 Materials for moulding, 216. 

 Mathematical conditions of deposition, 



. 203, 211. 

 Mechanical conditions of deposition, 203, 



210. 



Mercury solutions, 223. 

 Metals, to prepare, for deposits, 229. 

 Methods of studying electro-deposition, 



198. 

 Morris and Johnson's brassing process, 



222. 



Motion of articles in the vat, 232. 

 Moulding, materials for. 216. 

 Moulding, method of, 229. 

 Moulding by phosphorous composition, 



230. 

 Moulds, to render conducting, 230. 



NECESSITY of proper proportions of water, 

 207. 



Negative substances necessary to depo- 

 sition, 207. 



, solutions, 221. 



Nitrate of lead coats copper, brass, or 

 silver with lead, if in contact with zinc, 

 200. 



Nitrate of mercury coats silver in contact 

 with zinc or iron, or platinum in contact 

 with copper, 201. 



Non-adhesive deposits, 229. 



OBJECTS of practical deposition, 212. 

 One metal in one liquid, 198. 

 Ontological conditions of deposition, 212. 

 Order of affinities of metals for acids, 201. 

 Oiiile of copper in ammonia coats pla- 

 tinum in contact with zinc, 201. 



PALLADIUM solutions, 228. 



Parkes' patent silvering liquid, 221. 



Parlces' phosphorous moulding composi- 

 tion, 216. 



Patents, list of, 23!). 



Peculiarities of silver solutions, 235. 



I'll [ihorous moulding composition, 216, 

 230. 



.urns, liquid, as a conductor, 216. 



Pickling liquids. 216. 



Plates, names of, 209. 



Plating liquids, 225. 

 ^Platinised silver, 215. 



Platinum not affected by most acids, 201. 



Platinum salts and solir 



Polarity of plates in solutions, 208. 



Poles, names of, 209. 



Porous cells, 215. 



n of articles and dissolving- plate. 

 232. 



.11 of electrodes, 210. 



Positive substances necessary to deposition, 

 207. 



Potassium, cyanide of, to make, test. tic.. 



Potassium immersed in most liquids pro- 

 duce* chemical action, 201. 

 Preparing metals for non -adhesive deposits, 



Preparing metals for receiving deposits, 



229. 



Preparing surfaces of elastic moulds, 230. 

 Proportion of free acid in depo.iting 



liquid, 207. 

 Proto-chloride of tin coats antimony, tin, 



and copper, when In contact with zinc 



or lead, 200. 

 Proto-sulphatc of iron coats platinum if in 



contact with zinc, 200. 



QUALITY of a deposit, 231. 

 Quantity of a current, 231. 

 Quantity of a deposit, 231. 



RAPIDITY- of deposition, 212, 233. 

 Recovering gold by the dry method, 233. 

 ng gold solutions from liquids, 



23 ti. 



Recovering silver by the dry method, 238. 

 Recovering silver by the wet method, 



237. 

 Recovering silver from exhausted solutions, 



237. 



Regulating battery power, 230. 

 Regulating quantity, &c., of metal de- 



ired, 231. 



Rendering moulds conductible, 230. 

 Re-silvering old articles, 236. 

 Ruolz's gilding solution, 228. 

 Russell and Woolrich'i patent brassing 



process, 222. 



SALTS of iron, 221. 



Salts of lead, 221. 



Salts of platinum, 223. 



Salts (See names of Metals). 



Salzede's process for brassing, 222. 



Scratch-brush lathe, 215. 



Selecting liquids for deposition, 217, 22S. 



Selection of processes, 217. 



Silver and iron with sulphate of copper, 



199. 



Silver coated by filver, 207. 

 Silver, cyanide solution of. '22.V 

 Silver-cyanide soluiiop, to tr-t, &c., 236. 

 Silver-plating solutions, 224. 

 Silver, platinised, 215. 

 Silver, recovery of, from solutions, 237, 



238. 



Silver solutions and salts, 223. 

 Silver solutions, in ui.-imment of, 235. 

 Silver, to test the puiity of, 236. 

 Silvering by buttery process. 22 t. 

 Silvering by wash pro. v--., 221. 

 Single cell batteriM, 'J'>.', 214. 

 Sizes of electrodes, liquids, and wires, 



212. 



Smee's battery, 211. 

 Solid deposition of silver, 224. 

 Solid gold deposition, 228. 

 Solutions for depositing alloys, testing, 



217. 



Solutions, rules for working, 232. 

 Solutions (See nnmes of Metals, &c.) 

 Solutions, temperature of, 233. 

 Sources of electricity, 213. 

 Spread of deposit, 232, 233. 

 Steele's patent for gilding, 227. 

 Steele's patent for silvering by immersion, 



224. 



Steele's patent process for brassing, 222. 

 Stopping oft" to |n. .tion, 229. 



Stripping solutions, 2:',ii. 

 Sulphate of copper coats brass in contact 



with zinc. 200. 

 Sulphate solution for depositing zinc, 223. 



TEMPERATURE of solution, 210, 233. 



