LEGT.MKS FOR SEED 2/3 



and easily broken, but after several leaves have been formed, 

 a weeder may on some soils be used, even when sown for hay. 

 Cultivation should not be given when the leaves are wet, for 

 reasons given under field beans. (268) 



338. INSECT AND OTHER ENEMIES. So far as reported, the plant has no 

 special insect or fungous foes. It has been known to be attacked by grass- 

 hoppers, a caterpillar and a leaf-miner, and the underground parts of the stem 

 by the bean root-louse (Tychea phaseoli Passerini), but none of these has 

 assumed economic importance. 1 



339. Harvesting. If for dry forage, the crop should be cut 

 when the pods begin to form; if for silage, the pods may be 

 allowed to become somewhat more mature; while, if cut for 

 seed, one-half or more of the pods should be mature. If the 

 pods become too mature, they will burst open, and much of the 

 seed will be lost even before the plants are harvested. 



For hay, or silage, soy beans may be harvested with the 

 mowing-machine, although the woody stems are rather difficult 

 to cut. Large varieties may be successfully cut and bound with 

 a maize harvester, and cured into hay in shocks. Usually the 

 curing is similar to that of alfalfa, or clover, but is more diffi- 

 cult on account of the large leaves, which are easily lost in 

 curing. For seed, the bean harvester may be used. The or- 

 dinary threshing machine can, by adjusting or removing the 

 concaves, be used satisfactorily, although the bean thresher may 

 be preferable. In small quantities, they may be pulled by hand 

 and threshed with a flail, both operations being comparatively 

 easy with this crop. Care is required in storing soy beans in 

 order that fermentation, to which they are subject, may not 

 occur and injure their vitality. Storing in loosely woven sacks 

 is recommended. 



340. Value. The seeds of soy beans are characterized among 

 legumes in not having any starch in their cotyledons, and in 



1 Kentucky Sta. Bui. No. 98 (1902), p. 20. 



