178 



Copper and Copper-base Alloys 



TABLE 2 

 SILICON BRASS NO. 1 



General, Data — Strip" 

 Copper, 77.74%; silicon, 1.30%; lead, nil; zinc, balance 



Property 



Tensile strength, p.s.i. (000 omitted) 



Elongation, % in 2 in 



Apparent elastic limit, p.s.i. (000 omitted) 



Yield strength, 0.5 % extension, p.s.i. (000 omitted) 



Yield strength, 0.2 % offset, p.s.i. (000 omitted) 



Yield strength, 0.1 % offset, p.s.i. (000 omitted) 



Rockwell hardness F, Ke-in. ball, 60-kg. load 



Rockwell hardness B, Ke-ia- ball, 100-kg. load 



Rockwell hardness G, Ke-in- ball, 150-kg. load 



Rockwell hardness 15-T, Ke-ui- ball, 15-kg. load 



Rockwell hardness 30-T, Ke-in- ball, 30-kg. load 



Young's modulus of elasticity, p.s.i 



Melting point, °F 



Density, lb. per cu. in 



Coefficient of expansion, per °C. from 25-300°C.<' 



Electrical conductivity, % I.A.C.S., 68°F.'J 



Thermal conductivity, B.t.u. per sq. ft. per ft. per hr. per °F 



Specific gravity 



" All tests conducted on 0.040-in. stock. 



» 6 B. & S. Nos., hard, 0.090-0.015 mm. grain size at ready-to-finish, respectively, 



' Refer to 1300''F. anneal (1 hr. at temperature). 



** Approximate values. 



Hard^ 



Soft" 



.0 20.7 294 37.2 44.0 500 55.5 605 64.8 ( 

 Percent Reduction cf Area by Rolling 

 23456789 

 BS,S Numbers Hard 



Chart 4. — The effect of cold roUing on the tensile strength and 

 apparent elastic limit of silicon-brass No. 1 strip, previously annealed 

 to two different grain sizes, 0.015 and 0.090 mm. (77.74% copper, 

 1.30 % silicon, balance zinc) (0.040-in. stock). 



"§ 120 

 o 



d^' 110 



8 100 



^ 90 







^. 80 



i<; 



o 70 



_ 60 



D 

 CQ 



-^ 50 



5 40 



0) 



"§ 30 

 o 



= 20 

 i 10 



6 



11.0 20.7 29.4 37.2 44.0 50.0 55.5 60.5 64.8 

 Percent Reduc+ion of Area by Rolling 

 1234 56789 

 B&S Numbers Hard 

 Chart 5. — The effect of cold rolling on the Rockwell hardness and 

 percentage elongation in 2 in. of silicon-brass No. 1 strip, previously 

 annealed to two different grain sizes, 0.015 and 0.090 mm. (77.74 % 

 copper, 1.30% silicon, balance zinc) (0.040-in. stock). 



10 



