PLATE 2. 
Figure. 
Atomic 
percentage 
of tin. 
Per cent, 
by weigiit 
of tin. 
Magni¬ 
fication. 
Method of cooling 
the ingot. 
Method of 
etching. 
Description. 
i 
1 
12 
Sn 6 
10-15 
X 18 
V.s.c. not chilled 
HCl + FeCU 
a, dark. C' complex, light. 
13 
10-15 
X 280 
55 9 5 
95 
Patch of C' complex (a -|- 3). 
14 
Sn 9 
15-6 
X 120 
C. 880° 
95 
Primary and chill primary 
of cc (light), in matrix 
that was liquid at chilling 
temperature. 
15 
15-6 
X 18 
C. 777° 
99 
a, light. fS, dark. 
16 
n 
15-6 
X 18 
V.s.c.c. 546° 
95 
9 5 99 
17 
59 
15-6 
X 18 
V.s.c.c. 470° 
99 
a, dark. C' complex, lisfht. 
18 
59 
15-6 
X 280 
V.s.c.c. 546° 
99 
Uniform dark f3, margin 
of white 3. a. outside. 
19 
55 
15-6 
x280 
V.s.c.c. 470° 
95 
' 
Patch of C' complex (a + 3), 
bordered by 8. cc outside. 
20 
Sn 12 
20-3 
X 18 
S.c.c. 805° 
99 
Primary at, light. Liquid 
darker. Chill primary of 
/3, darkest. 
21 
59 
20-3 
X 18 
V.s.c.c. 775° 
95 
Partly dissolved a, light. 
Ground of solid striated/?. 
22 
55 
20-3 
X 18 
C. 550° 
99 
Light X that has crystal- 
liseil out of the solid 
uniform /?. Dark /?. 
23 
Sn 13-5 
22*5 
X 18 
"VT — o 
V.S.C.C. / i o 
95 
Striated /? free from a. 
