PLATE 4. 
1 
i 
' Figure. 
1 ^ 
1 
I 
Atomic 
percentage 
of tin. 
Per cent. 
Ijy weight 
of tin. 
Magni¬ 
fication. 
Method of cooling 
the ingot. 
Method of 
etching. 
Description. 
36 
Sn 15-5 
25-5 
X 45 
C. 452° 
HCl + FeCls 
C' complex. Oblique illumi¬ 
nation. 
37 
25 • 5 
X 550 
C. 452° 
C' complex. Vertical illu¬ 
mination. 
38 
Sn 16 
26-25 
X 18 
V.s.c.c. 752° 
if 
Dark /3. Tin-rich liquid 
^Yhite. 
39 
5? 
26 • 25 
X 18 
V.s.c.c. 738° 
ii 
/3 filling ingot. 
40 
26-25 
X 280 
Not chilled 
a 
Crystals of S in C' complex. 
41 
Sn 17 
27-65 
X 45 
V.s.c.c. 745° 
a 
Maximum of /3 in liquid. 
42 
?? 
27-65 
X 18 
C. 731° 
NH 3 
Dark in tin-rich matrix. 
43 
Sn 18 
29-05 
X 18 
C. 734° 
HCl + FeCls 
/3 decomposing (D. reaction). 
44 
Sn 19 
30-4 
X 125 
C. 733° 
ii 
J) ii 
45 
Sn 18 
29-05 
X 45 
V.s.c.c. 728° 
ii 
Homogeneous. Probably y. 
46 
Sn 17 
27 - 65 
X 45 
C. 495° ' 
a 
Commencement of S crystals. 
47 
27 *05 
X 250 
C. 450° 
a 
AVhite 5 in C' complex. 
