PLATE 9. 
' Figure. 
i 
i 
1 
[ 
Atomic 
percentage 
of tin. 
Per cent, 
by weight 
of tin. 
Magni¬ 
fication. 
• Method of cooling Method of 
the ingot. etching. 
! 
i 
1 
Description. 
93 
Sn 50 
65-1 
X 18 
After 60 hours at HCl + FeCls 
350° 
' 
Traces of in bands of H. 
Tin-rich liquid dark. 
1 
1 
94 
>5 
65 • 1 
X 18 
After 21 days at ! ,, 
350° 
. 
entirely gone. Polyhedra 
of H. Dark tin - rich 
matrix. i 
1 
1 95 
Sn 45 
60-4 
X 45 
After 21 days at ' ,, 
350° 
j 
Uniform H, with holes. ^ 
No liquid. No i 
i 
96 
Sn 42 
57-5 
X 18 
24 days at 350° , ,, 
Compact H, containing 
Many cavities (black). 
97 
Sn 40 
55-4 
X 45 
21 days at 350° ^ ,, 
j 
Comjjact H, containing >/. i 
98 
Sn 60 
73-7 
X 45 
21 days at 350° ,, 
Light polyhedra of H in 
the H -t tin eutectic. 
i 
99 
Sn 85 
91-3 
X 45 
21 days at 350° „ 
i 
1 
1 
Two types of H crystals in 
the eutectic. 
100 
Sn ? 
1 
7 
X 45 
' 
4 
H made by prolonged stir¬ 
ring of Sn 90 at 350° by i 
means of a copper stirrer. ' 
101 
Sn 50 
1 
65-1 
1 
X 18 
10 days at 350° then ' ,, 
heated to 400° 
and liquid produced from 
H by heating for a short 
time to aliove 400°. 
